Capability
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Item | Normal capability | Specific capability |
| Layer count | Rigid-flex PCB | 2 ～14 | 2 ～24 |
| Flex PCB | 1 ～10 | 1 ～12 | |
| Board | Min. Thickness | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm |
| Max. Thickness | 6mm | 8mm | |
| Max. Size | 485mm * 1000mm | 485mm * 1500mm | |
| Hole & Slot | Min.Hole | 0.15mm | 0.05mm |
| Min.Slot Hole | 0.6mm | 0.5mm | |
| Aspect Ratio | 10:01 | 12:01 | |
| Trace | Min.Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Tolerance | Trace W / S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Hole to hole | ± 0.075mm | ± 0.05mm | |
| Hole Dimension | ± 0.075mm | ± 0.05mm | |
| Impedance | 0 ≤ Value ≤ 50Ω : ± 5Ω 50Ω ≤ Value : ± 10%Ω | ||
| Material | Basefilm Specification | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Main supplier | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Coverlay Specification | PI : 2mil 1mil 0.5mil | ||
| LPI Color | Green / Yellow / White / Black / Blue / Red | ||
| PI Stiffener | T : 25um ～250um | ||
| FR4 Stiffener | T : 100um ～2000um | ||
| SUS Stiffener | T : 100um ～400um | ||
| AL Stiffener | T : 100um ～1600um | ||
| Tape | 3M / Tesa / Nitto | ||
| EMI shielding | Silver film / Copper / Silver ink | ||
| Surface finish | OSP | 0.1 - 0.3um | |
| HASL | Sn : 5um - 40um | ||
| HASL(Leed free) | Sn : 5um - 40um | ||
| ENEPIG | Ni : 1.0 - 6.0um | ||
| Ba : 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Plating hard gold | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| Flash gold | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni : 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| Immesion silver | Ag : 0.1 - 0.3um | ||
| Plating Tin | Sn : 5um - 35um | ||
| SMT | Type | 0.3mm pitch Connectors | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 Component | |||
Our Certifications
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